CSAC2334 Thermal Interface Material (TiM) reliability tester

Buyer

Semiconductor Catapult

Estimated value

£100k

Location

Wales

Deadline

2 December 2026

Published

10 November 2026

Category

Laboratory, optical and precision equipments (excl. glasses)

Trade

Architecture, surveying and engineering · Laboratory and scientific equipment

Suitable for SMEs

Not flagged

View the official notice on Find a Tender

In plain English

Semiconductor Catapult seeks a thermal interface material reliability tester with adjustable bond line and pressure capabilities for its data centre applications. No special requirements are stated.

Description from the notice

Semiconductor Catapult is interested in Ai characterisation tools and hardware and data centre applications. Thermal management is part of this scope and vision. We would like to expand our capabilities by installing a thermal interface materials reliability tester that is capable of adjusting the bond line measurements and adjusting the pressure applied for each test. The reliability of Thermal interface materials is important for data centre applications.